Wire Bond Process Engineer

Job description

Monitor and optimize Wire Bond manufacturing processes to achieve targets in Quality, Yield, Productivity, and Cost. Investigate manufacturing issues, customer complaints, and quality excursions by performing root cause analysis and implementing corrective/preventive actions. Drive continuous improvement projects to enhance process robustness, equipment utilization, OEE, yield performance, and operational efficiency. Establish and maintain process control systems, including SPC, OCAP, FMEA, control plans, and engineering specifications. Collaborate with cross-functional teams including Production, Equipment Engineering, Quality, Industrial Engineering, Planning, and R&D to resolve manufacturing challenges and improve factory performance. Analyze manufacturing data and develop data-driven solutions for process optimization and defect reduction. Conduct regular Gemba activities, risk assessments, and process audits to ensure manufacturing compliance and operational excellence. Support customer audits, internal audits, and quality management system requirements. Drive factory KPIs improvement, including Yield, Quality, Capacity, OEE, Cycle Time, and Cost Reduction targets. Requirements: Bachelor’s degree or above in Engineering or a related field. TOEIC 600+ or equivalent English proficiency. Within 2 years of working experience. Semiconductor industry experience is preferred. Good communication and teamwork skills. Leadership experience or potential is a plus. Proactive, responsible, and willing to learn in a dynamic environment. More information about NXP in Greater China... #LI-2370