Staff Process Technology Integration Engineer

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology can change lives for the better. It can heal us, entertain us, and make us more connected, productive, and understanding of the world around us. And we’re looking for talent who feel the same: people who want to leave the planet better than they found it, those who don’t shy away from humanity’s challenges but are determined to help solve them. AMD is powering the next generation of supercomputing, high-performance computing, cloud, and AI. Whether you’re designing next-gen processors, enabling AI breakthroughs, or creating go-to-market plans, every role at AMD contributes to something bigger — technology that moves the world forward. THE ROLE: You will interface with our HBM (High Bandwidth Memory DRAM) vendor’s teams in order to drive resolution of silicon manufacturing issues impacting yield, reliability or performance of HBM in AMD’s AI products in the Process Technology Integration team. Your role can also extend to driving yield, reliability or performance of AMD designed processor chips at wafer fabrication foundries. You will need to drive deeper engagement with the HBM vendor or wafer fab to better understand their process, make the right decisions jointly in terms of evaluating and implementing process improvements, as well as provide the necessary technical inputs to other AMD teams across foundry operations, yield, product & platform engineering, quality and reliability teams. This role will require you to interact closely with the silicon vendor (HBM or foundry) and various global AMD teams. THE PERSON: You should have a passion for process technology and the desire to work at the cutting edge to make great products. You will need to “think like a process integrator/ fab technologist” and influence the HBM vendor/silicon foundry and AMD global teams to make the right technology decisions for manufacturing AMD products. KEY RESPONSIBILITIES: Provide expertise in process and integration for advanced Front/Middle/Back End Of line modules The above applies to both HBM/DRAM as well as logic process flows Detailed review of systematic defect and parametric signatures with the HBM vendor/silicon foundry, and oversight of F/M/BEOL issues across products and technology nodes. Jointly design and analyze process improvement (CIP/BKM) evaluations run at the HBM vendor/silicon foundry. Provide technical assessment for AMD process change review board for CIP/BKM roll-out decisions. Hands-on basic product yield analysis (hardbin, softbin & parametric data) as well as foundry WAT/ electrical test parameter analysis. Ability to understand test data from both HBM and logic test flows. Close collaboration with device analysis teams to understand structural and parametric fail mechanisms for yield loss, potential reliability and quality issues, and deduce process failure mechanisms. Interface with supplier quality & reliability engineering teams to provide technical inputs for potential process excursions/material review board, as well as to assess the root cause of reliability/HTOL fails and drive the right corrective actions in the process flow with the HBM vendor/silicon foundry. Maintaining the overall F/M/BEOL "technology encyclopedia" for current technology nodes (on memory & logic), including failure analysis/defect pareto/process change history and speculative process flows. Keeping abreast of forward-looking industry trends in the area of wafer fab process integration (HBM/DRAM & logic), unit processes, materials and fabrication equipment, as well as competitive analysis/teardowns. PREFERRED EXPERIENCE: Professional experience in the semiconductor industry across multiple technology nodes/generations Experience with advanced semiconductor technologies for HBM/DRAM fabrication OR on FinFET technology nodes. Must be able to understand and explain basic process flows on both products. Direct experience in both memory & logic products is highly valuable. Hands on experience in unit process modules and/or process integration, which can include one or more of FEOL (isolation, gate stack, patterning, epi), MEOL (replacement gate, contact) or BEOL (interconnect). Knowledge of PFA and FI techniques used in Device Analysis, including the ability to deduce fail mechanisms and process steps used. Strong communication skills so as to be able to interact with and influence a wide range of stakeholders including the (external) vendor/foundry and (internal) foundry interface, yield, product engineering, device analysis, quality & reliability, platform/validation & design teams, in a globally distributed environment across time zones ACADEMIC CREDENTIALS: Bachelor's, Master’s or Ph.D. degree preferred in a technical field such as Electrical Engineering, Chemical Engineering, Materials Science and Engineering or Physics/Chemistry LOCATION: Singapore #LI-CC6 #LI-HYBRID #LI-D&I Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.