SHANGHAI STAFF R&DPRODUCT DVL ENGINEER (SI BtB) SH 200233

Job description

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Description: Job Overview Leads technical domain of singe/ multiple strategic development projects from initial ideation to final production. Job Requirements BU / FUNCTION DESCRIPTION Our purpose in Data and Devices is to create a safer, sustainable, productive and connected future across our key markets: 1. Artificial Intelligence (AI) 2. Cloud 3. Enterprise/Telecommunications 4. Tier 3/Business Retail Equipment (BRE) 5. Internet of Things (IoT) 6. In these markets, we are driving growth and innovation with an industry-leading product portfolio, global manufacturing capabilities and the expertise and dedication of each of our employees across all functions. AI is an emerging trend of a global industry and AI chip volume is growing. The purpose of D&D Socket team is to create a socket platform for: 1. Large size and high speed signaling (224G/448Gbps) for AI GPU, x89 CPU and Switch NPU 2. S mall pitch, High density and high speed signaling (224G/448Gbps) for CPO, CPC and Near Chip 3. And to provide timely, technically differentiated, muti-gen solution through co-architect with our customers ROLE OBJECTIVE As a Signal Integrity Engineer in D&D Socket team, you will focus on the electrical design, simulation, and verification-validation testing of the CPU socket and internal connector products - targeting high speed communications and connectivity in datacenters and wireless infrastructure.You will be expected to independently work on projects in the areas of signal integrity for socket product and system design including modeling, simulation, testing and printed circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing and operations to execute leading edge products designs. You will manage technical elements for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication, evaluation and production verification testing. RESPONSIBILITIES 1. Work with mechanical engineers to develop new products. Simulate SI performance and provide a design direction to mechanical engineers to achieve target SI performance. 2. Work with PCB designers to develop SI evaluation boards. Provide a deign guide and review the layout design. Measure SI performance and validate simulation result. 3. Work with product managers design-in new business. Communicate with customers and provide solution to achieve customer’s requirements. 4. Manage technical elements in signal integrity design, simulation and validation activities through product development cycles. Develop new method or improve existing techniques. What your background should look like EDUCATION/KNOWLEDGE 1. Bachelor’s degree on Electrical Engineering/Electromagnetic Wave Engineering, 2. Master’s degree preferred. 3. Minimum of 5 years of work experience in a signal integrity engineering role. 4. Experience with interconnect design or experience with connector. 5. Signal integrity analysis tools (Ansys HFSS, Keysight ADS). 6. Test instruments (Vector Network Analyzer, TDR) 7. A solid understanding of electromagnetic theory and electrical circuit behavior. 8. Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix the problems. SixSigma methodologies or other strong data analytics background is a PLUS. 9. Cording skill of Python, C++, Visual Basic, Matlab is a PLUS. 10. Familiarity with printed circuit board design, fabrication and assembly. 11. Proficient in Altium Designer is a PLUS. 12. Excellent verbal and written communication skills. 13. Ability to work in a global environment –, fluent in English (verbal/written), able to collaborate with individuals across geographies. 14. Individual must be highly motivated, a quick learner, and able to work independentl NICE TO HAVE SKILLS/EXPERIENCE 1. Printed circuit board design, fabrication and assembly (Altium, AutoCAD). 2.Communication systems (high-speed servers, switches, routers, storage). 3. Direct customer design and support experience. 4. Application and test knowledge of high-speed devices and equalization techniques is a plus. 5. Design experience with high-speed servers, switches, routers, and storage is a plus. Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork Job Locations: BUILDING 5, 1F-8F, NO.1528 GUMEI ROAD SHANGHAI, Shanghai 200233 China Posting City: SHANGHAI Job Country: China Travel Required: 10% to 25% Requisition ID: 155643 Workplace Type: Onsite External Careers Page: Engineering & Technology Apply Now Start apply with LinkedIn Please wait... TE Connectivity Home Applicant Privacy Equal Employment Opportunity Cookie Consent Manager Other Policies TE Connectivity does not accept unsolicited assistance from third parties for employment opportunities. All CVs/resumes submitted to any TE employee by a third party without a valid written search agreement for that specific position will not be entitled to any form of compensation and such submission shall be deemed the sole property of TE. No fee will be paid in the event an individual is hired by TE regardless of any third party submission where no pre-existing written search agreement is in place. 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