高性能封装（先进封装）首席集成技术专家

Job description

This role will define High-Performance Packaging opportunities, build ecosystem engagement strategies in China, and lead cross-functional programs connecting internal business units with local customers, OSATs, foundries, IDMs, equipment/materials suppliers, universities, research institutes, and industry platforms. Your Role Identify Market & Tech Trends: Track advanced packaging technology inflection points and roadmaps in China—spanning WLP, Fan-Out, 2.5D/3D, Chiplets, HBM packaging, TSV, RDL, hybrid/fusion bonding, advanced substrates, CMP, cleaning, deposition, lithography, and metrology. Map Ecosystem Landscape: Map the local semiconductor packaging ecosystem and continuously evaluate key players, technical capabilities, capital investments, localization needs, and strategic collaboration opportunities. Drive Strategic Partnerships: Develop and execute engagement plans with Chinese customers, OSATs, foundries, IDMs, equipment/materials suppliers, universities, research institutes, and industry consortia. Translate Insights to Execution: Convert ecosystem insights into actionable product requirements, application development priorities, partner strategies, and go-to-market (GTM) recommendations for internal teams. Lead Technical Programs: Formulate Statement of Work (SOW), Proof of Concept (POC), Design of Experiments (DOE), and joint development proposals that align customer technical needs with the company’s material and process capabilities. Who You Are Education: Master’s degree or higher in Materials Science, Microelectronics, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related engineering fields. Domain Expertise: 10+ years of hands-on R&D experience in 300mm wafer processes, equipment, materials, or integration, with a strong preference for advanced packaging background. Program Leadership: 5+ years of experience leading external collaborations, customer engagements, ecosystem programs, or driving SOW/POC/DOE execution. Industry Network: Strong professional network and deep working knowledge of China’s advanced packaging landscape, including local customers, OSATs, foundries, IDMs, suppliers, and research platforms. Preferred Qualifications Experience partnering with advanced packaging consortia, innovation hubs, or key semiconductor industry clusters in China. Proven ability to navigate ambiguity, influence across matrixed global organizations, and translate complex technical topics into strategic business recommendations. Entrepreneurial mindset, high self-drive, and exceptional resource alignment capability to deliver business results. 本职位将负责定义高性能封装的技术与业务机会，制定中国先进封装生态的合作策略；同时作为核心纽带，推动关键项目落地，全面打通公司内部业务单元与中国本土客户、封测厂、晶圆厂、IDM、设备及材料供应商、高校、科研机构及产业平台之间的协同合作。 主要职责 把握技术趋势与路线图： 精准识别中国先进封装领域的关键技术拐点与路线图，涵盖晶圆级封装（WLP）、扇出型封装（Fan-Out）、2.5D/3D、Chiplet、HBM相关封装、TSV、RDL、混合键合、熔融键合、先进基板、CMP、清洗、沉积、光刻及量测等技术方向。 梳理与评估生态图谱： 深入梳理中国先进封装生态系统，持续跟踪重点企业的技术能力、投资动态、国产化替代需求及战略合作契机。 制定并推进生态合作计划： 建立并执行针对中国客户、封测厂、晶圆厂、IDM、设备与材料厂商、高校、科研机构及产业联盟的深度合作计划。 洞察转化与内部赋能： 将外部生态洞察转化为内部产品需求、应用开发优先级、合作伙伴策略及市场进入（GTM）建议。 联合开发与技术落地： 负责制定 SOW（工作任务书）、POC（概念验证）、DOE（实验设计）及联合开发方案，将客户的技术痛点与公司的材料及工艺能力进行高效对接。 基本要求 学历背景： 材料科学、微电子、化学工程、电子工程、机械工程或相关工程专业硕士及以上学历。 行业经验： 10 年以上 300mm 晶圆工艺、设备、材料或集成研发的实操经验，有先进封装领域研发背景者优先。 项目与合作经验： 5 年以上外部合作、客户对接、生态项目领导及 SOW/POC/DOE 制定与落地的实际经验。 行业资源： 深度熟悉中国先进封装产业链，在本土客户、封测厂、晶圆厂、IDM、设备/材料商及科研平台方面拥有深厚的行业资源与网络。 优先条件 具备先进封装产业联盟、创新平台或中国半导体产业集群的深度合作经验。 具备极强的抗压与应变能力，能在高度不确定的环境中高效工作；具备跨矩阵组织的协同影响力，能将复杂的技术问题转化为可执行的商业策略。 具备创业者思维与强烈的自驱力，善于整合各方资源并以结果为导向推动项目闭环。