Engineer I -Process (Ball Attach)

Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you. Visit our careers page to see what exciting opportunities and company perks await! Job Description: The Ball Attach Engineer I is responsible for supporting, establishing, and improving ball attach processes in PLP assembly operations. The role includes start-up/line ramp activities, including process recipe creation and sustaining production performance, driving yield improvement, and actively participating in. The position requires strong analytical capability, hands-on troubleshooting, and collaboration with cross-functional teams to ensure stable, efficient, and high-quality manufacturing operations. Job Description: Lead and support start-up of Ball attach line and new products Establish initial process conditions and validate readiness for mass production Monitor early production performance and stabilize process during ramp-up phase Identify and mitigate start-up risks affecting yield, quality, and throughput Monitor and maintain ball attach process parameters to ensure stability and consistency Develop, define, and maintain ball attach process recipes (e.g., EFO settings, bonding force, ultrasonic power, time, temperature profiles) Perform DOE (Design of Experiments) to determine optimal process windows Continuously optimize recipes to improve yield, efficiency, and reliability Standardize and release qualified recipes for production use Ensure compliance with established process control plans and specifications Perform regular process audits and line checks Analyze yield trends and defect data (e.g., missing balls, ball bridging, ball deformation) Identify root causes and implement corrective and preventive actions Respond to production issues and equipment-related abnormalities Conduct root cause analysis using standard methodologies (5 Whys, Fishbone, 8D) Coordinate with Equipment, Quality, and Production teams for resolution Participate in process improvement projects and cost reduction activities Recommend and implement best practices for improved efficiency Maintain and update process documentation including work instructions and SOPs Ensure compliance with internal quality standards and audit requirements Support internal and external Customer audits Requirements/Qualifications: Bachelor’s Degree in Engineering (Electronics, Industrial, Mechanical, Chemical, or equivalent) Minimum of 3 years experience in semiconductor specific to WLCSP or BGA process Experience on handling Ball Attach, Ball Repair, Reflow, Flux rinse and Shear process Working knowledge of SPC, MSA/GR&R, DOE, PFMEA, and problem-solving methodologies. Strong analytical and problem-solving skills; ability to interpret SPC charts and process data. Good communication skills and ability to work in a team-oriented environment. Knowledge of safety protocols and cleanroom practices. Strong experience with WLCSP or advanced packaging tools is highly preferred Proficiency in MS Office and maintenance management systems. Strong analytical and problem-solving skills Leadership and mentoring capability Good communication and teamwork skills High attention to detail and sense of accountability Travel Time: 0% - 25% To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.