Senior Staff Engineer Design Bangalore Btp

Job description

Drive physical design and timing closure activities for hierarchical blocks and full-chip SoC designs, meeting aggressive area, performance, and power (PPA) targets. Implement and optimize low-power design methodologies, including designs with multiple voltage domains, power islands, and advanced power-reduction techniques. Collaborate closely with cross-functional teams to ensure seamless integration of package, design, and implementation requirements. Develop, enhance, and drive physical design methodologies and automation flows to continuously improve Quality of Results (QoR), productivity, and design efficiency. Analyze and resolve complex implementation challenges while ensuring design robustness, scalability, and manufacturability. Contribute to best practices, technical innovations, and continuous improvements within the physical design organization. Strong hands-on experience in end-to-end physical design and timing closure for advanced SoCs. Deep understanding of low-power implementation techniques, including multiple voltage and power domains. Good knowledge of I/O planning and package co-design considerations. Proven ability to drive design closure and improve QoR through methodology and flow enhancements. Self-driven, detail-oriented, and capable of working effectively in a collaborative team environment. Bachelor's or Master's degree in Electronics Engineering, Microelectronics, VLSI Design, or a related field. Hands-on experience in SoC physical design, including floorplanning, placement, clock tree synthesis (CTS), routing, and timing closure. Strong experience with industry-standard EDA tools for physical design, verification, and signoff. Proficiency in scripting and automation using Shell, Perl, Tcl, and Make-based flows. Solid understanding of advanced semiconductor technology nodes (40nm, 28nm, and 22nm) and the associated physical design challenges. Strong analytical and problem-solving skills with the ability to identify, debug, and resolve complex design issues. Demonstrated commitment, ownership, and determination in delivering high-quality results within the area of expertise. Well-organized, methodical, and detail-oriented approach to work. Proactive mindset with the ability to take initiative and overcome challenges through creativity and innovation. Strong team player with excellent collaboration and interpersonal skills. Ability to effectively coordinate with cross-functional teams and actively share knowledge and expertise with colleagues. Excellent communication skills with the ability to share information comprehensively, accurately, and effectively. Passion for continuous learning, professional development, and exploring new technologies and methodologies. Exposure to low-power design methodologies and physical verification flows. Experience working in a fast-paced, collaborative semiconductor product development environment. Ability to drive design closure while meeting performance, power, area (PPA), quality, and schedule targets. We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. Anand Rawal