Process and Equipment Tech
NXP · Kuala Lumpur
Applications are made on NXP's own site. We never sit in the middle.
Job description
Plating Process Technician Carryout the following activities Set up Plating Line as process specification Setting up recipes based on product requirement Set up and maintenance of plating baths and miscellaneous related equipment related to electroplating Responsible for chemical addition based on lab analysis Chemical Filtration & Leaching activity Anode Top Up for respective plating lines Requirement: 1) Diploma in Engineering (Chemical, Mechanical) or related 2) Previous experience in electroplating in semiconductor assembly Plating Equipment Technician Carryout the following activities Set up Plating Line Loader and Unloader Change Over of Loader and Unloader Carryout periodical maintenance for plating machine Maintenance of plating machine fittings Replacement of Plating Pumps and Rectifiers Serving Pumps and Blowers Requirement: 1) Diploma in Engineering (Electric/ Electronic, Mechanical) or related 2) Previous experience in electroplating in semiconductor assembly #LI-DNI