Staff Engineer Maintenance Melaka

Job description

In this role, you will lead the maintenance and reliability strategy for Wire Bond and Plasma equipment, ensuring safe operations, high equipment availability, optimal performance, and cost-effective maintenance execution. You will also oversee maintenance teams, drive TPM and continuous improvement initiatives, troubleshoot equipment issues, develop technical capabilities through training and certification programs, and ensure compliance with Safety, Health, and Environment (SHE) requirements. Develop and establish comprehensive maintenance strategies to ensure all equipment, including metrology equipment, operates safely with high availability, reliability, and quality performance Lead the Wire Bond and Plasma planned maintenance teams, as well as maintenance technician groups in Assembly, to execute unscheduled maintenance activities in a timely and effective manner Manage Wire Bond and Plasma maintenance costs while sustaining equipment performance at optimal levels Manage the maintenance system, maintenance activities, and maintenance personnel for Wire Bond Assembly and Plasma equipment to achieve maximum equipment efficiency and cost effectiveness Coordinate Wire Bond and Plasma Total Productive Maintenance (TPM) systems and activities within Production, including skill-level training, certification programs, and cross-functional improvement initiatives Coordinate all Safety, Health, and Environment (SHE) activities Establish and enhance equipment setup, conversion, and troubleshooting guidelines to ensure reliable machine uptime Investigate equipment breakdowns and implement effective corrective actions to prevent recurring failures Train and develop the Wire Bond and Plasma technical team by defining competency models and driving technical certification programs You strive for excellence in semiconductor equipment maintenance and reliability, bringing extensive experience in Wire Bond and Plasma processes, leading maintenance teams, and driving TPM and continuous improvement initiatives. You strive for operational efficiency through strong expertise in equipment troubleshooting, preventive and predictive maintenance, cost control, technical team development, and ensuring compliance with Safety, Health, and Environment (SHE) standards. Bachelor's Degree in Engineering (Mechanical, Electrical, Electronics, Mechatronics, Manufacturing, or related field) Minimum 8-10 years of experience in semiconductor manufacturing equipment maintenance, with significant exposure to Wire Bond and Plasma processes Proven experience leading maintenance teams, including engineers, technicians, and TPM activities Strong knowledge of preventive, predictive, and corrective maintenance methodologies Experience managing maintenance budgets, spare parts, and cost control initiatives Familiarity with Total Productive Maintenance (TPM), Lean Manufacturing, and Continuous Improvement program Strong troubleshooting and root cause analysis skills for equipment failures and reliability issues Experience developing technical competency frameworks, training roadmaps, and certification program Solid understanding of Safety, Health, and Environment (SHE) requirements within a manufacturing environment We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.