Staff Engineer Simulation And Package Design Methodology Villach

Job description

Develop and support simulation methodologies, design flows, and tool environments for Chip-Package-Board (CPB) Co-Design and advanced package development in Linux-based HPC environment Drive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis supporting semiconductor package and system development Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting and support to product development projects worldwide Enable simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions Collaborate closely with Business Lines, Design Systems, package development teams, and external technology partners to address simulation requirements and develop best-in-class engineering solutions Drive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities to continuously improve simulation capabilities and engineering productivity Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or a related technical discipline At least 4 years of professional experience in semiconductor package development, simulation, design methodologies, EDA environments, or related engineering fields Strong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system development Hands-on experience with industry-standard simulation environments such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL, or comparable engineering platforms Proven track record in developing, optimizing, and deploying simulation methodologies, engineering workflows, and design environments Solid knowledge of Linux and one or several of the following programming languages: Python, bash, MATLAB, Perl, skill Strong analytical and problem-solving skills combined with excellent communication abilities and a customer-oriented mindset Experience with development and integration of Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation is an advantage Fluent English skills are required; German language skills are considered as an advantage We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.