Senior Principal Optical Packaging Engineer United Kingdom Cambridgeshire Cambridge

Job description

Working across research, Azure engineering, product teams, suppliers, and external partners, you will translate system-level optical, electrical, thermal, and mechanical requirements into package architectures, component specifications, assembly and process requirements, test vehicles, and qualification strategies, while working through trade-offs and risk management across optics, electronics, packaging, thermal, mechanical, networking, manufacturing, and reliability. Shape next-generation optical and advanced packaging technologies for AI infrastructure and high-performance computing. Work at the intersection of optics, photonics, semiconductor packaging, silicon, networking, and AI system design. Influence package architectures integrating photonic devices, electronic ICs, ASICs/chiplets, interposers, optical interfaces, and thermal solutions. Collaborate across research, engineering, sourcing, manufacturing, and product teams, as well as with industry partners. Help move technologies across the complete lifecycle, from architecture and prototype development through supplier qualification and production readiness. Translate advanced research and packaging innovation into scalable technologies with real-world product impact. Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Optical Engineering, Physics, or a related technical field, or equivalent practical experience. 5+ years of industry experience in advanced semiconductor packaging, optical/photonics packaging, heterogeneous integration, electronic packaging, or related hardware technologies. Experience in advanced packaging and assembly, in one or more of the following areas: 2.5D/3D integration, interposers/RDL, fine-pitch interconnects, die attach/bonding, underfill, moulding, adhesives, and thermal management. Experience integrating optical/photonics devices with electronic ICs and package structures, with an understanding of several of the following: optical coupling and alignment, electrical interconnects, thermal/mechanical behaviour, package reliability, and manufacturability. Hands-on experience in one or more stages of the package development and productisation lifecycle, including process characterisation, design validation, reliability qualification, failure analysis, DFM, and manufacturing readiness. Experience working with one or more types of external manufacturing or technology partner, such as foundries, OSATs, optical component/module suppliers, equipment suppliers, or material suppliers, including activities such as technical assessments or manufacturing-readiness reviews. Experience with co-packaged optics (CPO), optical I/O, silicon photonics, optical engines, lasers, or high-speed optical interconnects. Experience with advanced packaging technologies such as CoWoS, SoIC, EMIB, fan-out packaging, chiplet integration, wafer-level packaging, or interposer-based heterogeneous integration. Experience with fibre attach, active/passive optical alignment, optical coupling, lens integration, alignment tolerance analysis, or optical link-budget evaluation. Experience developing technologies for AI infrastructure, high-performance computing, high-speed networking, datacentre systems, or other high-bandwidth applications.