Low Power Analog Mixed Signal Technologist Senior Director San Diego California United States Of America

Job description

## Company: Qualcomm Technologies, Inc. ## Job Area: Engineering Group, Engineering Group > ASICS Engineering General Summary: The Senior Director of Low Power Analog & Mixed-Signal Technologist will serve as the key technology and organizational leader responsible for defining and executing the long-term strategy for advanced sensing, mixed-signal semiconductor platforms, and intelligent edge systems. This leader will drive innovation and product differentiation across Robotics, Extended Reality (XR), Industrial IoT (IIoT), Intelligent Sensors, and AI-enabled embedded platforms. The role requires a unique combination of deep technical expertise, executive leadership, business acumen, and cross-functional influence. The successful candidate will work with multiple engineering organizations and senior technical leaders while shaping technology roadmaps, investment priorities, ecosystem partnerships, and multi-generation platform strategies. This position will play a critical role in developing technologies for next-generation sensor ASIC IP, mixed-signal subsystems, intelligent sensing architectures, and edge AI platforms, while ensuring alignment between technical execution, customer requirements, and business objectives. Qualifications * Ph.D. in Electrical Engineering, Computer Engineering, or related discipline with 10+ years of relevant industry experience OR * M.S. in Electrical Engineering, Computer Engineering, or related discipline with 14+ years of relevant industry experience Additionally: * Proven experience leading large engineering organizations consisting of directors, managers, architects, and senior technical contributors. * Extensive expertise in low-power analog, mixed-signal, sensor, and semiconductor system architecture. * Demonstrated success defining and delivering complex semiconductor products from concept to high-volume production. * Experience leading global cross-functional teams spanning silicon development (pre/post bringup), firmware, software, validation, packaging, manufacturing, and product engineering. * Strong track record of driving technology strategy, technical innovation, and organizational transformation. * Experience managing external partners, technology suppliers, foundries, IP providers, and strategic ecosystem relationships. * Demonstrated ability to influence executive leadership and business stakeholders through technology vision and execution excellence. Leadership and Technical Responsibilities Technology Strategy and Vision * Define and own the long-term technology roadmap for low-power analog, mixed-signal, sensing, and intelligent edge computing platforms. * Drive technology planning for Robotics, XR, Industrial Automation, Intelligent Sensors, and Edge AI applications. Organizational Leadership * Build a high-performance engineering culture focused on innovation, execution excellence, technical rigor, and continuous learning. * Foster collaboration across global cross-functional engineering organizations and external technology partners. * Drive engineering process improvements, quality initiatives, and operational excellence across the organization. * Mentor senior technical teams across systems engineering, platform integration, and architecture execution. Technical Leadership * Provide executive oversight of system architecture across sensing, mixed-signal ICs, AI processing, embedded software, communication interfaces, packaging, and system integration. * Guide architecture tradeoffs involving power, performance, scalability, latency, reliability, safety, security, and cost. * Lead technology review boards and critical architecture decision forums. * Drive development of platform architectures that enable reusable technologies across multiple product families and business segments. * Champion innovation through patents, publications, strategic research initiatives, and industry engagement. Ecosystem and Industry Leadership * Build strategic relationships with customers, suppliers, foundries, technology partners, universities, and research organizations. * Drive external collaborations that accelerate innovation and product differentiation. Principal Duties and Responsibilities Program Leadership * Oversee a portfolio of mixed-signal, sensor, and intelligent edge technology programs spanning multiple product generations. * Align technology roadmaps with business requirements, customer needs, and market opportunities. * Establish execution frameworks, milestones, and risk mitigation plans for key development programs. * Ensure successful program delivery from concept initiation through commercialization and production ramp. Advanced Semiconductor Platform Development * Direct development of advanced mixed-signal technologies such as Analog Front Ends (AFEs), ADCs and DACs, Low-Power Sensor Interfaces, Timing and Synch/Asynch Architectures, Power Management IP, Sensor Fusion Platforms, Intelligent Edge Processing Architectures, AI-Enabled Sensor Systems. * Guide architecture and implementation decisions involving CMOS technologies, heterogeneous integration, advanced packaging, chiplets, and system-in-package solutions. * Ensure product reliability, manufacturability, yield optimization, and cost effectiveness throughout the development lifecycle. Robotics and Intelligent Sensing Leadership * Define technology strategies for tactile sensing, multi-modal sensing, robot perception, autonomous systems, and intelligent control platforms. * Drive integration of advanced sensor technologies with AI, machine learning, and robotics software frameworks. * Establish scalable platform strategies that support multiple generations of robotics and intelligent edge products. * Enable differentiation through innovative sensing architectures and intelligent processing solutions and new sensing device designs in collaboration with process tech team. Business Impact and Execution * Influence product strategy, commercialization plans, customer engagements, and investment priorities. * Drive measurable business outcomes through technology leadership and execution excellence. Minimum Qualifications: • Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience. OR Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience. OR PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience. Preferred Qualifications * PhD Degree in Engineering, Information Systems, Computer Science or related field. * 15+ years of ASIC design and Systems Engineering or related work experience. * 15+ years of analog mixed signal domain expertise with low power designs. * 4+ years of experience working in a large matrixed organization. * 4+ years of supervisory experience. * 3+ years of work experience in a role requiring interaction with executive leadership (e.g., Vice President level and above). * 2+ years of working with operating budgets and/or project financials. * Experience leading semiconductor or system organizations focused on Robotics, XR, Industrial Automation, AI, or Intelligent Edge Computing. * Deep understanding of edge AI architectures, sensor fusion algorithms, machine learning systems, and autonomous platforms. * Knowledge of functional safety, reliability engineering, cybersecurity, and mission-critical embedded systems. * Experience leading development of custom ASICs, sensor platforms, SoCs, or large-scale semiconductor portfolios. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here.