Hardware Engineer, AI Accelerator Module Design

Job description

The Hardware Design, Rack-scale Technology and Platforms (HDRTP) engineering team designs, develops, validates, and delivers the hardware platforms that power Meta's AI and HPC infrastructure, deployed in data centers worldwide. Our designs are published for industry adoption through the Open Compute Project Foundation. We are seeking a senior AI Accelerator Module Design Engineer to serve as the technical owner for the electrical and PCB design of accelerator modules supporting Meta's custom silicon (MTIA) and third-party AI accelerators. This is a lead individual-contributor role: you will own module-level electrical architecture end to end from requirements definition and ASIC package-to-board co-design through schematic, stackup, power delivery, bring-up, and volume production across multiple concurrent programs and silicon generations. You will define the design methodologies, reference architectures, and design-rule standards that other engineers and ODM partners build against; resolve the hardest cross-domain trade-offs between signal integrity, power integrity, thermal, mechanical, and cost; and influence ASIC and rack-level architecture decisions upstream of the module. You will operate with minimal direction in an ambiguous, fast-moving environment, and will mentor and raise the technical bar for PCB and module engineers across the team.