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Creganna Medical (Part of TE Connectivity)

DONGGUAN SR R&DPRODUCT DVL ENGINEER (SI IO) GD 523071

Creganna Medical (Part of TE Connectivity) · 2026/10/19

Full-timeOn-sitePosted 19 October 2026
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Job description

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. 职位描述: 工作概况 TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems BU / FUNCTION DESCRIPTION Our purpose in Data and Devices is to create a safer, sustainable, productive and connected future across our key markets: 1. Artificial Intelligence (AI) 2. Cloud 3. Enterprise/Telecommunications 4. Tier 3/Business Retail Equipment (BRE) 5. Internet of Things (IoT) 6. In these markets, we are driving growth and innovation with an industry-leading product portfolio, global manufacturing capabilities and the expertise and dedication of each of our employees across all functions. AI is an emerging trend of a global industry and AI chip volume is growing. The purpose of D&D Socket team is to create a socket platform for: 1. Large size and high speed signaling (224G/448Gbps) for AI GPU, x89 CPU and Switch NPU 2. S mall pitch, High density and high speed signaling (224G/448Gbps) for CPO, CPC and Near Chip 3. And to provide timely, technically differentiated, muti-gen solution through co-architect with our customers ROLE OBJECTIVE As a Signal Integrity Engineer in D&D Socket team, you will focus on the electrical design, simulation, and verification-validation testing of the CPU socket and internal connector products - targeting high speed communications and connectivity in datacenters and wireless infrastructure.You will be expected to independently work on projects in the areas of signal integrity for socket product and system design including modeling, simulation, testing and printed circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing and operations to execute leading edge products designs. You will manage technical elements for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication, evaluation and production verification testing. 职位要求 As a Principal Signal Integrity Engineer of DDN socket team, you will focus on creating relationships with customer innovators and influencers, defining and driving technical activities, coordinating and facilitating technical engineering related communications for internal/external customers, creating the product standard for a key technology, and contributing to technical roadmap of the socket products. RESPONSIBILITIE S Contribute to high-speed technology (224/448G) and product development decisions Drives innovation and execution to increase competitiveness of socket interface products Organize and lead conference workshop for new product development Conduct continuous learning program and SI training to peers and cross-function teams Act as leader of global socket SI group, mentors and coaches team’s engineers. 岗位职责与任职要求 EDUCATION/KNOWLEDGE Bachelor’s degree on Electrical Engineering/Electromagnetic Wave Engineering, Master’s degree preferred. Minimum of 5 years of work experience in a signal integrity engineering role. Expert level knowledge of interconnect design or experience with connector. High level of competency in Signal integrity analysis tools (Ansys HFSS, Keysight ADS). High level of competency in Test instruments (Vector Network Analyzer, TDR) A solid understanding of electromagnetic theory and electrical circuit behavior. Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Six-Sigma methodologies or other strong data analytics background is a PLUS. Familiarity with printed circuit board design, fabrication and assembly. Proficient in Altium Designer is a PLUS. Cording skill of Python, C++, Visual Basic, and/or Matlab Ability to view and edit simple 3D models using Creo/Solidworks Excellent verbal and written communication skills. Ability to work in a global environment, fluent in English (verbal/written), able to collaborate with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently NICE TO HAVE SKILLS/EXPERIENCE Printed circuit board design, fabrication and assembly (Altium, AutoCAD). Communication systems (artificial intelligence, high-speed servers, switches, routers, storage). Direct customer design and support experience. Application and test knowledge of high-speed devices and equalization techniques is a plus. Design experience with high-speed servers, switches, routers, and storage is a plus. 工作地点: 发布城市: DONGGUAN 职位所在国家/地区: China 出差: 10%-25% 申请 ID: 160984 工作地点类型: 混合办公 外部招聘页面: Engineering & Technology 立即申请 内部发布页面: ???? 雇佣经验: Less than 1 year 教育经验: Other TE Connectivity 主页 热门职位 查看所有职位 投资者 申请人隐私政策 Cookie 许可管理器 © 2023 TE Connectivity Corporation。版权所有。 Cookie 许可管理器 当您访问任何网站时,它可能存储或检索浏览器中的信息,大多数为 cookie 形式。我们尊重您的隐私权,因此您可以选择不允许某些类型的 cookie。但是,阻止某些类型的 cookie 可能影响您的网站体验以及我们能够提供的服务。 需要的 Cookie 需要这些 cookie 才能使用此网站,无法将其关闭。 需要的 Cookie 需要的 Cookie 提供者 描述 已启用 SAP as service provider 我们使用以下会话 cookie,使网站正常工作需要所有这些 cookie: "route" 用于会话粘性 "careerSiteCompanyId" 用于将请求发送至正确的数据中心 "JSESSIONID" 在会话期间位于访问者的设备上,以便服务器能够识别访问者 "Load balancer cookie"(实际的 cookie 名称可能不同)阻止访问者从一个实例跳转到另一个实例 需要来自提供者 SAPasserviceprovider 的 cookie,无法将其关闭 功能 Cookie 这些 cookie 可以通过记住您的登录详细信息、优化视频性能或提供有关如何使用网站的信息来在此网站上提供更好的客户体验。您可以随时自由选择接受或拒绝这些 cookie。请注意,如果您不接受这些 cookie,这些第三方提供的某些功能可能受影响。 同意所有 功能 Cookie 功能 Cookie 提供者 描述 已启用 YouTube YouTube 是一项视频共享服务,用户在此可以创建自己的档案,上传视频,以及观看、点赞和评论视频。选择拒绝 YouTube cookie 将无法观看 YouTube 视频或与其交互。 Cookie 政策 隐私政策 条款和条件 同意来自提供者 YouTube 的 cookie

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