Manager, Process Engineering - PECVD

Job description

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. Position Summary ASM is seeking a highly motivated Manager, Process Engineering to lead a team of process engineers within the PECVD (Plasma Enhanced Chemical Vapor Deposition) KPU . This role is responsible for driving process technology development, customer deliverables, productivity improvements, and technical leadership supporting next-generation semiconductor logic, memory, and advanced packaging applications. The successful candidate will combine deep PECVD process expertise with strong people leadership, guiding a team responsible for process development, optimization, characterization, and customer demonstrations. This individual will work closely with R&D, Product Management, Applications Engineering, Hardware Engineering, Manufacturing, and customers to develop differentiated process solutions and support ASM's technology roadmap. Key Responsibilities • Lead, develop, and manage a team of process engineers focused on PECVD thin film applications for logic, memory, and advanced semiconductor devices. • Establish team priorities, allocate resources, and drive execution against business objectives, customer commitments, and technology roadmaps. • Oversee development, optimization, and qualification of PECVD processes to meet film performance, productivity, and manufacturability targets. • Drive continuous process improvements to achieve customer specifications and address critical technology challenges. • Lead root cause analysis and problem-solving activities related to process performance, yield, integration, and productivity. • Collaborate with R&D, Product Engineering, Product Management, and Hardware Engineering teams to develop next-generation PECVD solutions. • Partner with global customers to understand technical requirements, support evaluations, and enable successful process transfers into manufacturing. • Manage project planning, execution, and prioritization of experiments, wafer processing, characterization activities, and customer deliverables. • Use data-driven methodologies to analyze process performance and provide technical recommendations that influence product and technology decisions. • Support customer escalations and provide technical leadership for complex process challenges. • Recruit, mentor, and develop engineering talent while fostering a culture of innovation, accountability, collaboration, and continuous learning. • Drive best practices in process development, documentation, knowledge sharing, and engineering excellence across the PECVD organization. Qualifications Required • Master's degree or Ph.D. in Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline. • 8+ years of semiconductor process engineering experience with significant focus on thin film deposition technologies. • Prior people management experience or demonstrated success leading technical teams and cross-functional projects. • Strong background in PECVD, CVD, ALD, or related thin film deposition technologies. • Experience developing and optimizing semiconductor processes for logic, memory, advanced packaging, or specialty semiconductor applications. • Demonstrated ability to lead complex technical programs and deliver results in a fast-paced environment. • Strong problem-solving, project management, and organizational skills. Preferred • Experience with die