Staff Process Engineer – Backside Processing, CMP & Thermal

Job description

As a Staff Process Engineer – Backside Processing, CMP & Thermal, you will lead the development, optimization, qualification, and sustainment of wafer thinning, backside processing, chemical mechanical polishing (CMP), and thermal processing technologies critical to advanced photonic device manufacturing. You will work hands-on with process equipment, consumables, materials, and metrology systems while collaborating with device, integration, lithography, etch, thin film, reliability, and manufacturing teams to develop robust, manufacturable process solutions.