Solution Director

Job description

Job Summary HCLTech is looking for an experienced SI/PI Packaging Design Architect with 15+ years of experience in signal integrity, power integrity and semiconductor package design. The ideal candidate will have strong expertise in high-speed interface design, package and substrate design, electromagnetic simulation, power delivery network optimization and advanced packaging technologies. The candidate will work closely with silicon design, package design, PCB, system architecture and manufacturing teams to deliver high-performance semiconductor solutions that meet signal integrity, power integrity, thermal and reliability requirements. Key Responsibilities Lead Signal Integrity (SI) and Power Integrity (PI) analysis for advanced semiconductor packages and high-speed interconnects. Drive package and substrate design optimization for high-performance computing, networking, AI/accelerator and SoC products. Perform pre-layout and post-layout SI/PI analysis, including crosstalk, insertion loss, return loss, impedance matching and power delivery network (PDN) analysis. Lead package-level and package-to-board co-design activities, including bump maps, escape routing, substrate stack-up and interconnect optimization. Perform electromagnetic (EM) simulations and analyze high-speed interfaces such as PCIe, DDR, HBM, SerDes, Ethernet and other high-bandwidth interfaces. Optimize power distribution networks, decoupling capacitor placement, impedance profiles and simultaneous switching noise. Collaborate with package design, RTL/SoC, PCB, thermal, mechanical and manufacturing teams to resolve design challenges. Define SI/PI design guidelines, simulation methodologies, sign-off criteria and design review processes. Provide technical leadership, mentor engineering teams and drive root-cause analysis for package- and system-level SI/PI issues. Support design feasibility studies, technology evaluation, customer reviews and technical proposals. Skill Requirements 15+ years of experience in semiconductor packaging, signal integrity, power integrity or package/board co-design. Strong knowledge of package substrate design, advanced packaging architectures and high-speed interconnect technologies. Expertise in SI/PI fundamentals, transmission lines, S-parameters, impedance control, crosstalk, reflections and PDN analysis. Hands-on experience with 3D electromagnetic simulation, package extraction and SI/PI sign-off. Experience with advanced package technologies such as FC-BGA, 2.5D/3D IC, chiplets and HBM integration . Knowledge of high-speed protocols such as PCIe, DDR, HBM, SerDes and Ethernet . Proficiency in relevant EDA tools such as Cadence Sigrity, Cadence Clarity 3D Solver, Ansys HFSS, Ansys SIwave or equivalent. Understanding of package stack-up, substrate materials, bump/ball assignments, parasitics, thermal constraints and manufacturing considerations. Strong problem-solving, technical communication and cross-functional collaboration skills. Other Requirements Experience leading SI/PI architecture, methodology development and technical sign-off for complex semiconductor packages. Exposure to advanced packaging for AI, HPC, networking and high-bandwidth memory solutions . Experience working with global semiconductor customers and multidisciplinary engineering teams. Apply now Information at a Glance Why HCLTech? At HCLTech, you'll supercharge your potential. You'll find your career. And you'll find your spark. All at a place that knows that helping its customers stay on top starts by putting its people first. HCLTech is a global technology company, home to more than 223,000 people across 60 countries, delivering industry-leading capabilities centered around digital, engineering, cloud and AI, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending June 2026 totaled $14.8 billion. Disclaimer Privacy Statement Terms of use Sitemap Raise a Grievance We use cookies on our site. Please read more about cookies policy here. Opens in a new tab. Opens in a new tab. Opens in a new tab. Opens in a new tab. Opens in a new tab. Opens in a new tab. Copyright © 2026 HCL Technologies Limited Cookie Consent Manager When you visit any website, it may store or retrieve information on your browser, mostly in the form of cookies. Because we respect your right to privacy, you can choose not to allow some types of cookies. However, blocking some types of cookies may impact your experience of the site and the services we are able to offer. Required Cookies These cookies are required to use this website and can't be turned off. Required Cookies Required Cookies Provider Description Enabled SAP as service provider We use the following session cookies, which are all required to enable the website to function: "route" is used for session stickiness "careerSiteCompanyId" is used to send the request to the correct data center "JSESSIONID" is placed on the visitor's device during the session so the server can identify the visitor "Load balancer cookie" (actual cookie name may vary) prevents a visitor from bouncing from one instance to another Cookies from provider SAPasserviceprovider are required and cannot be turned off Functional Cookies These cookies provide a better customer experience on this site, such as by remembering your login details, optimizing video performance, or providing us with information about how our site is used. You may freely choose to accept or decline these cookies at any time. Note that certain functionalities that these third-parties make available may be impacted if you do not accept these cookies. Consent to all Functional Cookies Functional Cookies Provider Description Enabled Vimeo Vimeo is a video hosting, sharing, and services platform focused on the delivery of video. Opting out of Vimeo cookies will disable your ability to watch or interact with Vimeo videos. Cookie Policy Privacy Policy Terms and Conditions Consent to cookies from provider Vimeo YouTube YouTube is a video-sharing service where users can create their own profile, upload videos, watch, like, and comment on videos. Opting out of YouTube cookies will disable your ability to watch or interact with YouTube videos. Cookie Policy Privacy Policy Terms and Conditions Consent to cookies from provider YouTube Advertising Cookies These cookies serve ads that are relevant to your interests. You may freely choose to accept or decline these cookies at any time. Note that certain functionality that these third parties make available may be impacted if you do not accept these cookies. Consent to all Advertising Cookies Advertising Cookies Provider Description Enabled Google Analytics Google Analytics is a web analytics service offered by Google that tracks and reports website traffic. Cookie Information Privacy Policy Terms and Conditions Consent to cookies from provider GoogleAnalytics Google Tag Manager Google Tag Manager is a tag management system for conversion tracking, site analytics, remarketing, and more. Privacy Policy Terms and Conditions Consent to cookies from provider GoogleTagManager LinkedIn LinkedIn is an employment-oriented social networking service. We use the Apply with LinkedIn feature to allow you to apply for jobs using your LinkedIn profile. Opting out of LinkedIn cookies will disable your ability to use Apply with LinkedIn. Cookie Policy Cookie Table Privacy Policy Terms and Conditions Consent to cookies from provider LinkedIn