Senior Technical Lead Post Silicon Validation

Job description

We are seeking an experienced SI/PI Engineer to join our Advanced Silicon Packaging team. In this role, you will be responsible for signal integrity and power integrity analysis, modeling, and design optimization of next-generation multi-die packaging architectures including 2.5D/3D integration, silicon interposers, and high-bandwidth memory (HBM) interfaces. Key Responsibilities Perform SI/PI analysis and design optimization for advanced silicon packages (CoWoS, EMIB, chiplet-based architectures, fan-out wafer-level packaging) ● Develop and validate high-speed channel models for package interconnects including bumps, microbumps, TSVs, RDL layers, and silicon/organic interposers ● Conduct full-wave electromagnetic (EM) simulations of package structures to characterize S-parameters, crosstalk, impedance, and insertion/return loss ● Design and optimize Power Distribution Networks (PDN) — including decoupling strategy, IR drop analysis, and AC impedance profiling from die to board ● Perform time-domain simulations (eye diagram, BER analysis) for high-speed serial and parallel interfaces (PCIe Gen5/6, UCIe, HBM3/3E, DDR5, SerDes >112 Gbps) ● Collaborate with IC design, package substrate design, PCB layout, and thermal/mechanical teams to co-optimize package electrical performance ● Develop and correlate simulation models with lab measurements (VNA, TDR, oscilloscope, power noise measurements) ● Define SI/PI design guidelines and constraints for package substrate stackup, routing rules, and bump/via assignments ● Support design-for-manufacturability (DFM) reviews with OSAT partners and substrate vendors ● Investigate and resolve SI/PI-related failures during silicon bring-up and validation phases Skill Requirements 5+ years of experience in SI/PI analysis for semiconductor packaging or high-speed PCB design ● Strong proficiency with industry-standard EM and circuit simulation tools: ○ EM Solvers: Ansys HFSS, Ansys SIwave, Cadence Clarity 3D, Keysight ADS Momentum ○ Circuit Simulation: Synopsys HSPICE, Cadence Spectre, Keysight ADS ○ PDN Analysis: Ansys RedHawk, Cadence Voltus, Sigrity PowerDC/PowerSI ● Deep understanding of transmission line theory, Maxwell's equations, and S-parameter analysis ● Experience with high-speed interface protocols (PCIe, UCIe, HBM, DDR, Ethernet SerDes) ● Proficiency in package stackup design, impedance control, and via transition optimization ● Hands-on experience with measurement correlation (VNA, TDR/TDT, near-field scanning) ● Programming/scripting skills (Python, MATLAB, Tcl) for automation and post-processing Preferred Qualifications ● Experience with 2.5D/3D advanced packaging technologies (CoWoS, EMIB, Foveros, hybrid bonding) ● Familiarity with chiplet-based disaggregated architectures and die-to-die interconnect standards (UCIe, BoW) ● Knowledge of co-simulation methodologies (chip-package-board co-design) ● Experience with statistical analysis and Monte Carlo methods for manufacturing variation impact ● Understanding of thermal-aware electrical analysis (electro-thermal co-simulation) ● Contributions to IEEE/DesignCon publications or industry standards committees (JEDEC, OIF, UCIe Consortium) ● Experience working with OSATs (ASE, Amkor, TSMC InFO/CoWoS) and substrate vendors Other Requirements Technical Environment Domain EM Simulation Tools & Technologies Ansys HFSS, SIwave, Cadence Clarity 3D Solver, Keysight EMPro Circuit Simulation HSPICE, ADS, Spectre, SystemVue PDN Analysis Layout/Design Scripting Measurement Standards RedHawk-SC, Voltus, PowerSI, PowerDC Cadence APD/SiP, Synopsys IC Compiler, Mentor Xpedition Python, MATLAB, Tcl, Perl VNA (Keysight PNA-X), TDR (sampling scope), real-time oscilloscope PCIe 5.0/6.0, UCIe 1.1, HBM3/3E, DDR5, 112G/224G SerDes Apply now Information at a Glance Why HCLTech? At HCLTech, you'll supercharge your potential. You'll find your career. And you'll find your spark. All at a place that knows that helping its customers stay on top starts by putting its people first. HCLTech is a global technology company, home to more than 230,000 people across 60 countries, delivering industry-leading capabilities centered around digital, engineering, cloud and AI, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending September 2026 totaled $14.8 billion. Disclaimer Privacy Statement Terms of use Sitemap Raise a Grievance We use cookies on our site. Please read more about cookies policy here. Opens in a new tab. Opens in a new tab. Opens in a new tab. Opens in a new tab. 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