APCC Shift Operations Manager

Job description

Job Details: Job Description: The Advanced Packaging Command Center (APCC) Shift Group Leader is a people manager responsible for leading a shift-based operations team that provides remote manufacturing and technical support to factory operations. This role ensures safe, reliable, disciplined and consistent execution of APCC services while maintaining strong partnership with supported factory teams and global stakeholders. The Shift Group Leader is accountable for people leadership, shift execution, operational performance, service quality, escalation management, capability development and continuous improvement. The role requires sound decision-making in a fast-paced manufacturing environment where priorities change rapidly, supported by a solid understanding of the semiconductor manufacturing flow to lead defect-related operational response and drive cross-functional problem solving across APCC and supported factories. Key Responsibilities People and Shift Leadership - Lead, supervise and develop APCC Technicians, Commanders and Runners supporting remote factory operations across assigned sites, technologies and service areas. - Own core people-management responsibilities, including onboarding, goal setting, performance management, recognition and handling of employee relations matters. - Ensure effective 24/7 shift operations, including staffing, attendance, overtime management, workload balancing, shift coverage and task prioritization. - Provide clear leadership and direction during rapidly changing manufacturing situations, balancing operational priorities, technical risk and service commitments. - Ensure team members complete required training and certification (e.g., L1O/L2O) and that training materials remain current with the latest specs and processes. - Build team capability through coaching, knowledge sharing, technical development and disciplined execution of standard work. - Establish an environment of safety, accountability, teamwork, continuous learning and effective cross-functional collaboration. Operational Execution and Escalation Management - Ensure timely response, acknowledgement, disposition and escalation of manufacturing or technical events in accordance with established procedures and service expectations. - Enforce compliance with the operating spec, escalation timelines and follow-up expectations. - Coordinate work across APCC, factory operations, engineering, equipment, automation, manufacturing and other stakeholder organizations, including global sites across time zones, to ensure issues are properly owned and resolved. - Serve as the primary shift leadership escalation point for operational abnormalities, high-impact events, staffing constraints, service disruptions and issues requiring management intervention. - Maintain effective shift-to-shift handover, ensuring significant events, open actions, risks and escalation status are clearly communicated. - Provide shift reports and operations review inputs and communicate significant events to management and site stakeholders. - Ensure compliance with EHS, information security, access control and data integrity requirements. Technical Leadership - Provide shift leadership for quality/Yield-related manufacturing events, ensuring appropriate initial assessment, containment, escalation, ownership and follow-through in partnership with manufacturing, process, yield, quality and engineering teams. - Apply knowledge of the semiconductor manufacturing flow to understand how upstream process conditions in wafer fabrication, wafer-level packaging and sort/test may appear as downstream defect or yield signals. - Use problem solving methodology and technical data to guide problem definition, challenge defect classification and disposition where needed, and route issues to the appropriate engineering owners. - Distinguish immediate operational containment needs from issues requiring deeper engineering investigation,and ensure repeat or systematic defects have clear ownership for root cause, corrective action and follow-up. Operational Performance and Continuous Improvement - Monitor operational data, KPIs, dashboards and trends to identify execution gaps, recurring issues and improvement opportunities. - Drive disciplined adoption of standard work, operational governance and continuous-improvement practices. - Partner with technical and operational stakeholders to improve execution consistency, responsiveness and service quality. - Ensure lessons learnt from manufacturing events, defect excursions and operational gaps are incorporated into team capability development and standard work where appropriate. - Drive follow-through on recurring operational or technical issues until sustainable corrective actions and ownership are established. Qualifications:Minimum Qualifications - Bachelor's degree in Engineering, Science or a related technical discipline. - 3+ years of experience as a people manager, shift leader or team leader of a factory/technical team of five or more employees, with responsibility for technical or operational deliverables. - Understanding of the end-to-end semiconductor manufacturing flow, with working knowledge of at least one of the following: wafer fabrication, wafer-level packaging or sort/test. - Ability to understand technical data and use it to support problem definition, operational decision-making and appropriate engineering escalation. - Demonstrated experience coordinating multiple priorities, managing escalations and delivering results in a time-sensitive operating environment. - Demonstrated ability to coach and develop team members and to make sound decisions under pressure. - Excellent written and verbal communication skills in English, including with global stakeholders and senior leaders. - Strong interpersonal skills with demonstrated ability to work effectively in a diverse and cross-functional team environment. - Demonstrated ability to operate effectively in ambiguous situations and maintain commitment to operational deliverables. - Willingness and ability to work in a compressed work week and shift-based operating model, including coordination with stakeholders across time zones. Preferred Qualifications - 6+ years of experience in semiconductor manufacturing, engineering, operations or technical support, including 3+ years leading teams. - Proven track record leading a team in a 24/7 high-volume manufacturing, command center, remote operations or factory support environment. - Working knowledge of semiconductor defect methodology and the ability to relate process conditions, defect signals and yield/quality excursions across the manufacturing flow. - Hands-on or leadership experience with wafer fabrication, wafer-level packaging and/or sort/test manufacturing operations. - Experience supporting semiconductor defect, yield or quality excursions. - Experience interpreting defect maps/images, defect Pareto/trend information, process data and equipment signals to support defect investigation and escalation. - Knowledge of structured problem-solving methodologies such as 8D, root-cause analysis, containment and corrective/preventive action. - Strong understanding of manufacturing operations, equipment support, process control, operational escalation and factory execution systems. - Knowledge of, or demonstrated aptitude for learning, manufacturing systems, automation platforms, dashboards and operational tools. - Experience using operational data, KPIs, dashboards and trend analysis to drive performance improvements. - Experience implementing standard work, operational governance, continuous improvement or quality management practices. - Experience collaborating across process, yield, equipment, manufacturing and quality engineering organizations to resolve complex manufacturing issues. We invite you to bring your experience and leadership skills to Intel and join us in driving innovation, opt