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ASM International

Senior Engineer, Process Engineering (ALD Advanced Packaging)

ASM International · Singapore (ASM Front-End Mfg (S) Ltd)

Full-timeOn-sitePosted 6 November 2026
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Job description

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. Job mission As a key member of our Advanced Packaging R&D team, you will lead the development and optimization of advanced Atomic Layer Deposition (ALD) processes for next-generation semiconductor applications. Combining deep technical expertise with hands-on experimentation, you will translate complex process challenges into innovative, manufacturable solutions and work closely with cross-functional and customer teams to successfully demonstrate and transfer technologies into high-volume manufacturing. What you will be working on • Work with semiconductor processing equipment to research, develop and optimize processes focused on developing ALD processes • Conduct experiments, measurements and drive conclusions out of complex experimental data sets • Develop innovative solutions and demonstrate these in the context of HVM semiconductor manufacturing • Staying up-to-date of state-of-the-art ALD processing applications in the semiconductor industry to be effective • Work hands-on with state-of-the-art semiconductor process equipment and optimize processes alongside the hardware for maximum efficiency</l

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